

INFINEON IRF7309TRPBF
Manufacturer No:
IRF7309TRPBF
Manufacturer:
Package:
8-SOIC (0.154, 3.90mm Width)
Description:
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IRF7309TRPBF information
INFINEON IRF7309TRPBF technical specifications, attributes, parameters and parts with similar specifications to INFINEON IRF7309TRPBF.
- Type
- Parameter
- Factory Lead Time
- 12 Weeks
- Contact Plating
- Tin
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Number of Pins
- 8
- Transistor Element Material
- SILICON
- Operating Temperature
- -55°C~150°C TJ
- Packaging
- Tape & Reel (TR)
- Series
- HEXFET®
- Published
- 2001
- JESD-609 Code
- e3
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- Number of Terminations
- 8
- ECCN Code
- EAR99
- Resistance
- 50mOhm
- Additional Feature
- ULTRA LOW RESISTANCE
- Subcategory
- Other Transistors
- Max Power Dissipation
- 1.4W
- Terminal Position
- DUAL
- Terminal Form
- GULL WING
- Current Rating
- 4A
- Base Part Number
- IRF7309PBF
- Row Spacing
- 6.3 mm
- Operating Mode
- ENHANCEMENT MODE
- Power Dissipation
- 1.4W
- FET Type
- N and P-Channel
- Transistor Application
- SWITCHING
- Rds On (Max) @ Id, Vgs
- 50m ? @ 2.4A, 10V
- Vgs(th) (Max) @ Id
- 1V @ 250?A
- Input Capacitance (Ciss) (Max) @ Vds
- 520pF @ 15V
- Current - Continuous Drain (Id) @ 25°C
- 4A 3A
- Gate Charge (Qg) (Max) @ Vgs
- 25nC @ 4.5V
- Polarity/Channel Type
- N-CHANNEL AND P-CHANNEL
- Turn-Off Delay Time
- 25 ns
- Continuous Drain Current (ID)
- 4A
- Threshold Voltage
- 1V
- Gate to Source Voltage (Vgs)
- 20V
- Drain Current-Max (Abs) (ID)
- 4A
- Drain to Source Breakdown Voltage
- 30V
- Pulsed Drain Current-Max (IDM)
- 16A
- FET Technology
- METAL-OXIDE SEMICONDUCTOR
- FET Feature
- Standard
- Nominal Vgs
- 1 V
- Height
- 1.4986mm
- Length
- 4.9784mm
Download datasheets and manufacturer documentation for INFINEON IRF7309TRPBF.
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IRF7309TRPBF Description
The fifth generation HEXFET of the International Rectifier Company uses advanced technology to achieve the lowest possible on-resistance area per silicon. This advantage, combined with HEXFET Power MOSFET's well-known fast switching speed and rough device design, provides designers with an extremely efficient device used in a variety of applications.SO-8 has been improved through a customized framework to enhance thermal and multi-chip capabilities, making it ideal for a variety of power applications. Through these improvements, a variety of devices can be used in applications that greatly reduce circuit board space. Package design for gas phase, infrared or wave soldering technology in typical printed circuit board installation applications, it is possible to consume more than 0.8W.
IRF7309TRPBF Features
Generation Technology
Ultra Low On-Resistance
Dual N and P Channel Mosfet
Surface Mount
Available in Tape&Reel
Dynamic dv/dt Rating
Fast Switching Lead-Free
IRF7309TRPBF Applications
This advantage, combined with HEXFET Power MOSFET's well-known fast switching speed and rough device design, provides designers with an extremely efficient device used in a variety of applications.
User Guide
Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.
MEANS OF PAYMENTFor your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and Wire Transfer. Net terms may be available for qualified customers upon approval.
RFQ (REQUEST FOR QUOTATIONS)Please ensure the part numbers and quantities are accurate and complete when submitting your RFQ.
Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

Step1:Prepare product

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step4:Individual Package

Step5:Anti-collision Filling

Step6:Packaging Box
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
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