AMD XCR3384XL-12FG324C

Manufacturer No:

XCR3384XL-12FG324C

Manufacturer:

AMD

Package:

FBGA

Description:

1mm PMIC 324 Pin 3.3V FBGA

Quantity:

Delivery:

Payment:

In Stock :Available

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XCR3384XL-12FG324C information

AMD XCR3384XL-12FG324C technical specifications, attributes, parameters and parts with similar specifications to AMD XCR3384XL-12FG324C.

Type
Parameter

Mount
Surface Mount

Package / Case
FBGA

Number of Pins
324

Packaging
Bulk

JESD-609 Code
e0

Pbfree Code
no

Moisture Sensitivity Level (MSL)
3 (168 Hours)

Number of Terminations
324

ECCN Code
3A991.D

Terminal Finish
Tin/Lead (Sn63Pb37)

Max Operating Temperature
70°C

Min Operating Temperature
0°C

Additional Feature
YES

HTS Code
8542.39.00.01

Subcategory
Programmable Logic Devices

Technology
CMOS

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
225

Supply Voltage
3.3V

Terminal Pitch
1mm

Reach Compliance Code
not_compliant

Time@Peak Reflow Temperature-Max (s)
30

Pin Count
324

Operating Supply Voltage
3.3V

Supply Voltage-Max (Vsup)
3.6V

Temperature Grade
COMMERCIAL

Number of I/O
220

Memory Type
EEPROM

Propagation Delay
12 ns

Frequency (Max)
83MHz

Programmable Logic Type
EE PLD

Number of Gates
9000

Number of Logic Blocks (LABs)
24

Speed Grade
12

Output Function
MACROCELL

Number of Macro Cells
384

JTAG BST
YES

In-System Programmable
YES

Length
23mm

Height Seated (Max)
2.5mm

Width
23mm

RoHS Status
RoHS Compliant

Lead Free
Contains Lead

Download datasheets and manufacturer documentation for AMD XCR3384XL-12FG324C.

XCR3384XL-12FG324C Overview

There are 384 macro cells in the network, which are high-power cell sites that provide radio coverage (tower, antenna, or mast) for a mobile phone network.It is part of the FBGA package.The device has 220 inputs and outputs.There are 324 terminations programmed into the device.As the terminal position of this electrical part is BOTTOM, it serves as an important access point for passengers or freight.Power is supplied by a voltage of 3.3V volts.The part is included in Programmable Logic Devices.The chip should be packaged by Bulk.It is programmed with 324 pins.The device can also be used to find YES.It is possible to construct digital circuits using 9000 gates, which are devices that serve as building blocks.High efficiency requires a voltage supply of 3.3V.It is recommended to store data in EEPROM.Surface Mount mounts this electronic component.324 pins are included in its design.Vsup reaches 3.6V as the maximum supply voltage.It is recommended that the operating temperature exceed 0°C.There should be a temperature below 70°C at the time of operation.It consists of 24 logic blocks (LABs).It is recommended that the maximum frequency be less than 83MHz.Programmable logic types can be divided into EE PLD.

XCR3384XL-12FG324C Features

FBGA package
220 I/Os
324 pin count
324 pins
24 logic blocks (LABs)

XCR3384XL-12FG324C Applications

There are a lot of Xilinx
XCR3384XL-12FG324C CPLDs applications.

Interface bridging
I/O expansion
Discrete logic functions
Bootloaders for FPGAs
Address decoders
Custom state machines
Digital systems
Portable digital devices
Handheld digital devices
Battery operated portable devices

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