MT40A1G8SA-062E:R Guide: Micron 8Gb DDR4-3200 Memory Component

If you are manufacturing memory modules (DIMMs) or repairing high-performance industrial PCs, you have likely encountered the Micron MT40A1G8SA-062E:R.

This chip is one of the most widely used "building blocks" in the DDR4 ecosystem. It is an 8 Gigabit (Gb) DRAM component running at 3200 MT/s. Its ubiquity makes it a standard, but its part number can be confusing. What does "062E" actually mean? Why is Revision "R" important?

This guide breaks down the datasheet and technical details of this essential Micron component.

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Table of Contents

• 1. Decoding the Part Number: What "062E:R" Means
  • The Breakdown Table
  • The Speed Grade "062E" (DDR4-3200)
  • Die Revision "R" (1z nm)
• 2. Technical Specifications & Architecture
  • x8 vs x16 Organization
• 3. Applications & Compatibility
  • Sourcing for Module Manufacturing
  • Price Analysis & Stock Availability
• 4. Cross-Reference & Alternatives
• 5. Conclusion

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1. Decoding the Part Number: What "062E:R" Means

Micron part numbers are packed with information. Let's decode MT40A1G8SA-062E:R.

The Breakdown Table

Code Segment	Meaning	Detail
MT	Micron Technology	Manufacturer.
40A	DDR4 SDRAM	1.2V Core Voltage.
1G8	Density & Org	8Gb capacity, organized as 1 Gig x 8.
SA	Package	78-ball FBGA (8mm x 12mm).
-062E	Speed Grade	$t_{CK} = 0.625ns$ $\rightarrow$ 3200 MT/s.
:R	Die Revision	Revision R (1z nm process).

The Speed Grade "062E" (DDR4-3200)

This is often the most confusing part. The code -062E refers to the clock cycle time ($t_{CK}$) in nanoseconds.

• The Math: $1 / 0.625ns = 1600 MHz$ Clock Frequency.
• Double Data Rate: $1600 MHz \times 2 = 3200 MT/s$.
• CAS Latency: The "E" typically denotes a CL = 22 timing profile (DDR4-3200AA).
• Takeaway: This chip is designed to run natively at 3200 MT/s without XMP overclocking.

Die Revision "R" (1z nm)

The :R suffix indicates the Die Revision.

• Evolution: Micron iterates its manufacturing process to shrink the die and improve yield. Common revisions include Rev. B, Rev. E, and now Rev. R.
• Rev R (1z nm): This is a mature, highly efficient process node. It generally runs cooler and provides better yields than older revisions.
• Compatibility Warning: When building a DIMM, do not mix die revisions on the same PCB. If you start your production run with Rev. R, finish with Rev. R to ensure signal integrity.

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2. Technical Specifications & Architecture

The MT40A1G8SA-062E:R is a discrete DRAM component, not a finished module.

• Density: 8Gb (1 Gigabits x 8).
• Voltage: 1.2V (VDD).
• Operating Temp: 0°C to 95°C (Commercial).
• Banks: 16 Banks (4 Bank Groups x 4 Banks).
• Package: 78-ball FBGA (Flip Chip Ball Grid Array).

x8 vs x16 Organization

This chip is configured as 1G x 8.

• x8 chips are the standard for desktop (UDIMM), laptop (SODIMM), and server (RDIMM) memory modules. You typically need 8 chips to make a Non-ECC rank, or 9 chips to make an ECC rank.
• x16 chips are typically used for soldered-down memory on thin laptops to save space, but they have lower performance (bank contention).
• Use Case: This chip is perfect for building standard 8GB (1 Rank) or 16GB (2 Rank) memory sticks.

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3. Applications & Compatibility

Sourcing for Module Manufacturing

Because this is a "Component" level part, the primary buyers are:

1. Module Houses: Companies assembling generic DDR4-3200 DIMMs.
2. Repair Technicians: Replacing a single failed chip on a soldered laptop motherboard (common in MacBook or Ultrabook repairs).
3. Industrial OEMs: Designing custom embedded boards with soldered RAM.

Price Analysis & Stock Availability

DDR4 prices are stabilizing as the market shifts to DDR5. However, 8Gb x8 3200 chips remain high volume.

Procurement Tip: Ensure you verify the Date Code and Die Revision. [Check Stock for MT40A1G8SA-062E:R at Aichiplink] to view inventory from verified distributors.

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4. Cross-Reference & Alternatives

If you cannot find the exact Micron part, the following are functionally equivalent (8Gb, x8, 3200 MT/s, FBGA-78):

• Samsung: K4A8G085W?-BCWE (The "?" denotes Die Rev, typically B, C, or D).
• SK Hynix: H5AN8G8N??R-XNC (The "XNC" denotes 3200 speeds).

Note: While electrical specs match, mixing brands on the same memory channel is not recommended.

5. Conclusion

The Micron MT40A1G8SA-062E:R is the workhorse of the DDR4-3200 era. Its 8Gb density and x8 organization make it the fundamental building block for the vast majority of 3200MHz memory modules in the market today. Understanding its Revision and Speed Grade ensures you source the exact part needed for your manufacturing or repair line.

Sourcing Memory Components Secure your supply chain for high-quality DRAM. Visit Aichiplink.com to search for MT40A1G8SA-062E:R and compatible Samsung/Hynix alternatives.

Search Micron 8Gb DDR4 Stock Now

 

 

 

 

 

Written by Jack Elliott from AIChipLink.

 

AIChipLink, one of the fastest-growing global independent electronic   components distributors in the world, offers millions of products from thousands of manufacturers, and many of our in-stock parts is available to ship same day.

 

We mainly source and distribute integrated circuit (IC) products of brands such as Broadcom, Microchip, Texas Instruments, Infineon, NXP, Analog Devices, Qualcomm, Intel, etc., which are widely used in communication & network, telecom, industrial control, new energy and automotive electronics. 

 

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